ARTEMOS
Agile RF Transceivers and Front-Ends for Future Smart Multi-Standard COmmunications ApplicationS
This project aims at developing architecture and technologies for implementing agile radio frequency (RF) transceiver capacities in future radio communication products. These new architecture and technologies will be able to manage multi-standard (multi-band, multi-data-rate, and multi-waveform) operation with high modularity, low-power consumption, high reliability, high integration, low costs, low PCB area, and low bill of material (BOM). This will not just require smart RF architectures in advanced CMOS and BiCMOS technology, but also need incorporating of e.g. MEMS technologies and novel simulation methodology for achieving these complex optimizations. The ARTEMOS consortium with partners in the full value-chain from semiconductor suppliers, system houses, application domain, research and universities, is confident that the realization of its ambitious objectives will assist Europe to achieve technological leadership in domains that are targeted by ENIAC.
Involved personnel
Paolo Banelli, Giuseppe Baruffa, Luca Rugini
International partners
- DMCE GmbH & Co KG
- AALTO University
- ART S.r.l.
- Brno University of Technology
- CEA-LETI
- Cavendish Kinetics B.V.
- Fachhochschule Kärnten
- SAS DelfMEMS
- Fachhochschule Hagenberg
- Foundation for Research and Technology Hellas
- IMC Austria GmbH
- Institut Telecom France
- Instituto de Telecomunicações
- Iquadrat Informatica S.L.
- Integrated Systems Development S.A.
- Johannes Kepler Universität Linz
- Lantiq A GmbH
- LEAT-CNRS
- NXP Semiconductors Belgium NV
- PULSE Finland OY
- ST-Ericsson (Grenoble) SAS
- Ericsson Modem Nuermberg GmbH
- Ecole Superieure D'Electricité
- THALES Communications SA
- TESLA, akciova spolecnost
- Technische Universiteit Delft
- Technische Universiteit Eindhoven
- Università Degli Studi di Perugia
- Universitat Politecnica De Catalunya
- Uppsala Universitet
- Teknologian tutkimuskeskus VTT
